Global Programs

In collaboration with the U.S. Department of State’s Bureau of Economic and Business (EB) Affairs, Arizona State University (ASU) is implementing a program to help diversify the global semiconductor supply chain. This initiative, funded by a $13.8 million cooperative agreement over a span of two years, is supported by the International Technology Security andInnovation (ITSI) Fund, established under the U.S. CHIPS and Science Act of 2022. The initiative seeks to expand semiconductor chip assembly, testing, and packaging (“ATP” or“downstream”) operations in key partner countries in the Americas (Costa Rica, Mexico, andPanama) and the Indo-Pacific (Indonesia, Philippines, and Vietnam), thereby fortifying a resilient supply chain for U.S. semiconductor manufacturers.The program's central mission is to enhance workforce capabilities within semiconductor chip ATP operations across key partner countries.

Sponsored by the U.S. Department of State's Bureau of East Asian and Pacific Affairs (EAP) and implemented by Arizona State University (ASU), the overarching objectives of this program are (1) to strengthen and increase national and regional cooperation of ASEAN Member States and the US government on federal, local, private sector, and academic levels; and (2) to develop and implement policies to foster science, technology, and innovation through increased funding mechanisms, data sharing, intellectual property generation, commercialization, and academic research partnerships.